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 HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Typical Applications
The HMC643 is ideal for: * EW Receivers
Features
Low RMS Phase Error: 3.5 Low Insertion Loss: 6.5 dB High Linearity: +38 dBm 360 Coverage, LSB = 5.625 Die Size: 2.75 x 0.99 x 0.1 mm
5
PHASE SHIFTERS - CHIP
* Weather & Military Radar * Satellite Communications * Beamforming Modules * Phase Cancellation
Functional Diagram
General Description
The HMC643 is a 6-bit digital phase shifter die which is rated from 9 to 12 GHz, providing 360 degrees of phase coverage, with a LSB of 5.625 degrees. The HMC643 features very low RMS phase error of 3.5 degrees and extremely low insertion loss variation of 0.6 dB across all phase states. This high accuracy phase shifter is controlled with complementary logic of 0/-3V, and requires no fixed bias voltage and is internally matched to 50 Ohms with no external components. Simple external level shifting circuitry can be used to convert a positive CMOS control voltage into complementary negative control signals.
Electrical Specifications, TA = +25 C, 50 Ohm System, Control Voltage = 0/-3V
Parameter Frequency Range Insertion Loss* Input Return Loss* Output Return Loss* Phase Error* RMS Phase Error Insertion Loss Variation* Input Power for 1 dB Compression Input Third Order Intercept Control Voltage Current *Note: Major States Shown Min. 9 6.5 15 12 7 3.5 0.6 22 38 <1 -10 / +15 Typ. Max. 12 10.0 Units GHz dB dB dB deg deg dB dBm dBm A
5 - 24
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Insertion Loss, Major States Only
0 -2 INSERTION LOSS (dB) -4 -6 -8 -10 -12 8 9 10 11 12 13 FREQUENCY (GHz)
Normalized Loss, Major States Only
4 3 NORMALIZED LOSS (dB) 2 1 0
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PHASE SHIFTERS - CHIP
5 - 25
-1 -2 -3 -4 8 9 10 11 12 13 FREQUENCY (GHz)
Input Return Loss, Major States Only
0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 8 9 10 11 12 13 FREQUENCY (GHz)
Phase Error, Major States Only
20 15 PHASE ERROR (degrees) 10 5 0 -5 -10 -15 -20 8 9 10 11 12 13 FREQUENCY (GHz)
Output Return Loss, Major States Only
0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 8 9 10 11 12 13 FREQUENCY (GHz)
Relative Phase Shift Major States, Including All Bits
400 RELATIVE PHASE SHIFT (degrees) 350 300 250 200 150 100 50 0 8 9 10 11 12 13 FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Relative Phase Shift, RMS, Average, Max, All States
30 RELATIVE PHASE SHIFT (degrees) 25 20 15 10 5 0 -5 -10 9 9.5 10 10.5 11 11.5 12 FREQUENCY (GHz)
RMS AVERAGE MAX
Input IP3, Major States Only
55 50 45 IP3 (dBm) 40 35 30 25 9 9.5 10 10.5 11 11.5 12 FREQUENCY (GHz)
5
PHASE SHIFTERS - CHIP
Input IP2, Major States Only
100
Input P1dB, Major States Only
40 35 30 25 20 15 10
90 P1dB (dBm) 9 9.5 10 10.5 11 11.5 12
IP2 (dBm)
80
70
60
50 FREQUENCY (GHz)
9
9.5
10
10.5
11
11.5
12
FREQUENCY (GHz)
RMS Phase Error vs. Temperature
20 RELATIVE PHASE SHIFT (degrees) 15 10 5 0 -5 -10 9 9.5 10 10.5 11 11.5 12 FREQUENCY (GHz)
+25C +85C -55C
Insertion Loss vs. Temperature, Major States Only
0
INSERTION LOSS (dB)
-2
-4
-6
-8
-10 9 9.5 10 10.5 11 11.5 12 FREQUENCY (GHz)
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Phase Error vs. State
20 15 PHASE ERROR (degrees) 10 5 0 9.5, 10, 10.5, 11, 11.5, 12 GHz
5
9 GHz
-10 -15 -20 0 45 90 135 180 225 270 315 360 STATE (degrees)
Absolute Maximum Ratings
Input Power (RFIN) Channel Temperature (Tc) Thermal Resistance (channel to die bottom) Storage Temperature Operating Temperature 27 dBm (T= +85 C) 150 C 130 C/W -65 to +150 C -55 to +85 C
Control Voltage
State Low (0) High (1) Bias Condition -2.5 to -3.5V @ 0.4 A Typ. 0 to +0.3V @ 0.4 A Typ.
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
Truth Table
Control Voltage Input Bit 1 0 1 0 0 0 0 0 1 Bit 2 0 0 1 0 0 0 0 1 Bit 3 0 0 0 1 0 0 0 1 Bit 3 1 1 1 0 1 1 1 0 Bit 4 0 0 0 0 1 0 0 1 Bit 4 1 1 1 1 0 1 1 0 Bit 5 0 0 0 0 0 1 0 1 Bit 5 1 1 1 1 1 0 1 0 Bit 6 0 0 0 0 0 0 1 1 Bit 6 1 1 1 1 1 1 0 0 Phase Shift (Degrees) RFIN - RFOUT Reference* 5.625 11.25 22.5 45.0 90.0 180.0 354.375
Any combination of the above states will provide a phase shift approximately equal to the sum of the bits selected. *Reference corresponds to monotonic setting
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
5 - 27
PHASE SHIFTERS - CHIP
-5
HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Outline Drawing
5
PHASE SHIFTERS - CHIP
Die Packaging Information [1]
Standard GP-2 Alternate [2]
NOTES: 1. ALL DIMENSIONS IN INCHES (MILLIMETERS) 2. DIE THICKNESS IS 0.004 3. BACKSIDE METALLIZATION: GOLD 4. BACKSIDE METAL IS GROUND 5. BOND PADS METALLIZATION: GOLD 6. OVERALL DIE SIZE 0.002
[1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation.
5 - 28
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Pad Descriptions
Pad Number Function Description These pads and die bottom must be connected to RF/DC ground. Interface Schematic
1, 3, 4, 6
GND
5
PHASE SHIFTERS - CHIP
5 - 29
2
RFIN
This port is DC coupled and matched to 50 Ohms.
5
RFOUT
This port is DC coupled and matched to 50 Ohms.
7, 9, 11, 15 8, 10, 12, 13, 14, 16
BIT6, BIT4 BIT3, BIT5 BIT6, BIT4, BIT3, BIT2, BIT1, BIT5
Inverted Control Input. See truth table and control voltage tables. Non-Inverted Control Input. See truth table and control voltage tables.
Application Circuit
Note:
This circuit converts a single line positive (0/+5V) control signal to complementary negative (0/-3V) control signals.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Assembly Diagram
5
PHASE SHIFTERS - CHIP
Handling Precautions
Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and flat. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC643
v01.0707
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz
Notes
5
PHASE SHIFTERS - CHIP
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
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